AFP/Optocap utilise its design and modelling capability which includes 3D package design optical modelling, thermal and stress modelling to ensure that an optimised package that meets the customers cost, performance and reliability requirements is achieved.
AFP/Optocap have a range of qualified fiber coupled and free-space optic package platforms including discrete SM, MM and PM fiber and fiber v-grooved arrays. Devices can be packaged into a butterfly packages, TO-can’s, TOSA and custom packages.
AFP/Optocap have capability for precision die attach for laser diodes using AuSn hard-solder onto C-mounts, CS-mounts and other types of submount. Placement accuracies range from 1um to 15um. LIV testing.